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Conductive adhesives belong to functional adhesives. Most are two-component epoxies. It is composed of main components, conductive filler, toughening agent, solvent and other additives. The main components play the role of adhesion, by adhesion strength, reliability, heat resistance, aging resistance, high and low temperature impact resistance and water resistance to be selected.
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Toughening agents generally use low molecular weight active toughening agents, such as liquid end carboxylic butyronitrile rubber, low molecular polyester, low molecular polyamide, low molecular polycarbon rubber and so on. Conductive filler plays a conductive role in the common use of silver powder, silver copper powder, silver quartz powder, etc., filled with pure silver powder adhesive conductivity is the best, the most stable.
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The thinners used to regulate viscosity are mostly inactive thinners, such as low molecular ketones, esters, ethylene glycol ether, isopropanol, turpentine, tetrahydrofuran and aromatic hydrocarbons. Toughened epoxy resin, silver powder and capacitant were taken from the scale according to a certain formula, and then mixed evenly and then added into the prescribed 2-ethyl group, 4-methyl imidazole. Used for assembling electronic components and replacing welding to bond silicon chips and electrodes. Conductive adhesives are one kind of functional adhesives.
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It is used for electronic components, devices assembly, bonding silicon chips instead of welding. Its advantage is to simplify the joint process, ensure machining accuracy and improve efficiency. This kind of adhesive can be divided into structural and non-structural adhesive. There are also solvents and solvents without solvent. In terms of its mechanical properties, it is better to use structural adhesives without solvents, especially those with outstanding shear strength.
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In terms of conductivity, the solvent containing conductive adhesives for rape. In hybrid integrated circuits, structural adhesives containing solvents are often used. The main components of conductive adhesives are adhesive body composition, conductive filler, toughening agent, solvent, and other additives. In conductive adhesives, the components play different roles.
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Adhesive action is the main component, according to the adhesive strength, reliability, heat resistance, aging resistance, high and low temperature impact resistance, water resistance, etc. The purpose of toughening agent is to improve the impact resistance of adhesive and to improve the strength of its stripping. In the epoxy system, the stability of the toughening agent should be considered when the toughening agent is selected. The toughening agent chosen should be reactive (active).
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Of course, the addition of toughening agent should not affect the conductive adhesive technology. Low molecular weight active toughening agents are commonly used. Such as liquid terminal carboxyl butyl eyeball rubber, low molecular polyester, low molecular polyamide, low molecular sulfur rubber, etc..
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There are many types of conductive fillers, commonly used silver powder, silver copper powder, silver quartz powder, etc. Among them, the adhesives with pure silver powder have the best and most stable electrical conductivity. At the same time, the size distribution and granule shape of conductive filler also affect the conductive effect of adhesive. The content of conductive filler in conductive adhesive has great influence on the conductivity of adhesive.
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Although conductive polymer materials have been developed, the conductive adhesive used in microcircuits is mainly filled with silver powder. In order to ensure the adhesion strength of conductive adhesive, the amount of conductive filler should not be too much. According to the requirements of hybrid integrated circuit assembly, conductive adhesive formulation is sometimes designed by ourselves. In assembly, the silicon chip is firmly attached to the substrate. If silver is burned, or any other method of welding is used, it is obviously not appropriate.
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Conductive adhesives are suitable for bonding silicon chips. This requires conductive adhesives have excellent physical, mechanical, electrical, thermal conductivity, heat aging, moisture resistance and other properties. The conductive adhesive can be prepared by using a two-component toughening epoxy system containing solvent and adding silver powder of certain specifications.
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